作　　者： ;

机构地区： 广东工业大学机电工程学院

出　　处： 《机电工程技术》 2020年第1期1-4,78,共5页

摘　　要： 为了研制用于蓝宝石减薄磨削的高性能树脂结合剂金刚石砂轮,对蓝宝石磨削过程中金刚石磨粒的动态变化及蓝宝石加工表面粗糙度进行研究。动态监测树脂结合剂金刚石砂轮磨削蓝宝石基片的表面质量、砂轮磨损及其磨损形式、砂轮不同磨损阶段的磨损形式变化及蓝宝石表面粗糙度Ra的变化。结果表明,砂轮初期磨损阶段磨粒破碎较为明显,后期磨损阶段磨粒脱落、黏附磨损占比较大达到45%,砂轮稳定的损耗速率为0.027 3 mm^3/s,磨耗比为17.37,蓝宝石最低粗糙度可以达到Ra0.260μm。为树脂结合剂砂轮制备的优化及蓝宝石背面减薄的磨削工艺优化提供了依据。 In order to develop a high performance resin-bonded diamond grinding wheel for sapphire thinning grinding, the dynamic change of diamond particles and the roughness of sapphire surface were studied. The surface quality of sapphire substrate, the wear of the wheel and its wear form, the wear form change of the wheel in different wear stages and the change of the surface roughness Ra of sapphire were monitored dynamically.The results show that the abrasive particles are broken obviously in the early wear stage. In the later wear stage, the percentage of abrasive particles falling off and adhesive wear is up to 45%. The stable wear rate of the grinding wheel is 0.027 3 mm^3/s, the wear ratio is 17.37,and the minimum roughness of sapphire can reach Ra0.260 μm. It provides the basis for the optimization of the preparation of resin bonded grinding wheel and the grinding process of sapphire back thinning.

关 键 词： 树脂结合剂 金刚石砂轮 蓝宝石 砂轮磨损 表面粗糙度

领　　域： []