机构地区: 中兴通讯股份有限公司
出 处: 《电子工艺技术》 2020年第1期17-21,36,共6页
摘 要: 随着高频混压多层线路板的普及,SMT组装过程中经常遇到与FR4板材失效机理不同的情况。重点就高频材料的孔口分层起泡问题进行研究,找到高频混压PCB孔口分层原因,给出了改善方案,为PCB的生产制造提供一定的指导建议。 With the popularization of high-frequency mix-dielectric multi-layer PCB,the failure mechanism is different from that of FR4 in SMT assembly process.Focusing on the blistering problem at the orifice of high-frequency materials,the reasons of orifice blistering of the high-frequency mix-dielectric PCB is found,and improvement measures are given to provide some guidance and suggestions for production and manufacturing of PCB.
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