作　　者： (郭鹏超）; (朱德贵）; (高宇）; (李美洁）; (胡春峰）; (宋庭丰）;

机构地区： 西南交通大学材料科学与工程学院、材料先进技术教育部重点试验室,成都610031

出　　处： 《电工材料》 2017年第4期6-11,共6页

摘　　要： 采用热等静压固相烧结制备了CuCr(29)Zr(1)和CuCr(28)Zr(1)TiC(1)合金,并对合金的致密度、显微组织、维氏硬度、导电率和力学性能进行了研究。结果表明:热等静压制备的CuCr触头材料组织均匀致密,近等轴状的Cr颗粒均匀分布在Cu基体中;添加TiC明显提高了合金的力学性能,而导电率变化很小。CuCr(29)Zr(1)和CuCr(28)Zr(1)TiC(1)合金的致密度分别为99.3%和99.5%,导电率为39.78%IACS和34.78%IACS,抗拉强度为357.0 MPa和374.3 MPa。材料的断裂机理为Cu基体的韧性断裂,Cr颗粒的解理断裂以及Cu与Cr的界面断裂。 CuCr（29）Zr（1） and CuCr（28）Zr（1）TiC（1） alloys were prepared by hot isostatic pressing（HIP）. Their densities, microstructure, Vickers hardness, electrical conductivity, and mechanical properties were systemically investigated. The results indicate that dense samples are obtained and nearly equiaxed Cr particles are uniformly distributed in the Cu matrix. Additive of TiC particles could improve the mechanical properties of alloys, but electrical conductivity is not obviously changed. The relative densities of CuCr（29）Zr（1） and CuCr（28）Zr（1）TiC（1） alloys are 99.3% and99.5%, respectively. The relative electric conductivities are 39.78%IACS and 35.78%IACS, and the tensile strength are 357.0 MPa and 374.3 MPa, respectively. Fracture mechanisms of alloys are ductile fracture of Cu matrix, brittle fracture of Cr particles, and interfacial fracture between Cu matrix and Crparticles.

关 键 词： 合金 热等静压 微观组织 断裂机理