作　　者： (杨静晖）; (柏奇琪）; (张楠）; (黄婷）; (王勇）;

机构地区： 西南交通大学材料科学与工程学院,成都610031 西南交通大学材料先进技术教育部重点实验室,成都610031

出　　处： 《绝缘材料》 2017年第8期14-21,共8页

摘　　要： 近年来,随着微电子行业的快速发展,通过添加导热绝缘填料制备导热绝缘高分子复合材料受到广泛关注。本文综述了导热绝缘复合材料的导热绝缘机理,详细介绍了导热绝缘高分子复合材料的影响因素,主要涉及导热绝缘填料及其几何尺寸、填料在基体中的分散状态以及填料表面改性等,并概述了导热绝缘高分子复合材料的应用现状,最后对未来导热绝缘高分子复合材料的研究方向提出了建议与展望。 With the rapid development of microelectronics industry, the preparation of thermal conductive and insulating polymer composites via adding thermal conductive and insulating fillers has attracted many attentions. In this paper, the mechanisms of thermal conduction and insulation of polymer composites were summarized. The influence factors of thermal conductive and insulating composites were introduced, which include thermal conductive fillers and their physical dimension, the dispersion state of fillers in polymer matrix, and surface modification of fillers. The application status of thermal conductive and insu- lating polymer composites was also summarized. Finally, the suggestion and prospect on the research direction of thermal conductive and insulating polymer composites were proposed.

关 键 词： 导热 绝缘 高分子复合材料 导热机理 填料