作　　者： (古进）; (迟鸿燕）;

机构地区： 中国振华集团永光电子有限公司,贵州贵阳550018

出　　处： 《现代工业经济和信息化》 2017年第15期25-26,共2页

摘　　要： 对高可靠玻璃钝化表贴封装低压调整二极管的结构设计和制造方法进行了深入分析,确定了芯片的生产工艺以及后部封装工艺,器件运用合金工艺实现了低压特性,通过选取合适电阻率和厚度的N型硅片,采用多次磷扩散工艺提升了芯片的表面浓度,降低了产品正向压降水平,采用热钝化清洗工艺降低了器件的表面漏电流,通过选取合适的焊料将轴向产品与电极片进行烧结,实现了表贴封装。 This paper analyzes the high reliable glass passivated table structure design and manufacturing method of low pressure adjustment diode mount package, to determine the production process of the chip and the rear packaging technology, devices using alloy technology to achieve a low voltage characteristics, through selecting the appropriate N type silicon resistivity and thickness of the phosphorus diffusion process promoted by several times the surface concentration of chips, reduces the product forward voltage level, using thermal passivation cleaning technology reduces the device surface leakage current, by selecting the appropriate solder products and axial sintering electrode, the surface mount package.

关 键 词： 玻璃钝化表贴封装 合金工艺 热钝化