作　　者： (林金堵）;

机构地区： 《印制电路信息》编辑部

出　　处： 《印制电路信息》 2017年第9期5-10,共6页

摘　　要： 文章概评了PCB的高密度化和信号传输高频化是影响PCB高可靠性的主要原因。PCB高密度化和信号高频化必然带来高温化、减少焊接点面积和增加焊接点数量,因此产生更大的内应力和高的故障数和失效数,从而影响PCB的高可靠性。改善PCB的高导热性能和减少PCB焊接点数量是重要措施和方向,而在高导热的PCB内,埋置元器件是目前以至今后创新发展的根本道路! This paper reviews the high reliability of PCB because of the high density and high frequency signal transmission in PCB. PCB with high density and high frequency signal will inevitably bring about the high temperature, reduction of the welding area and increase of the number of welding points, resulting in greater internal stress and high number of faults and failure, thus affecting the high reliability PCB. It is an important measure and direction to improve the high thermal conductivity of PCB and reduce the number of PCB welding points, while the embedded components in high thermal conductivity PCB is the fundamental way to develop and innovate in the future!

关 键 词： 高可靠性 焊接点结合力 焊接点内应力 故障率 元件集成化