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Improved interfacial properties of GaAs MOS capacitor with NH3-plasma-treated ZnON as interfacial passivation layer
Improved interfacial properties of GaAs MOS capacitor with NH_3-plasma-treated ZnON as interfacial passivation layer

作  者: ();

机构地区: School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China

出  处: 《Journal of Semiconductors》 2017年第9期56-61,共6页

摘  要: The GaAs MOS capacitor was fabricated with HfTiON as high-k gate dielectric and NH3-plasma-treated ZnON as interfacial passivation layer (IPL), and its interracial and electrical properties are investigated compared to its counterparts with ZnON IPL but no NH3-plasma treatment and without ZnON IPL and no plasma treatment. Experimental results show that low interface-state density near midgap (1.17×10^12 cm^-2eV^-1) and small gate leakage current density have been achieved for the GaAs MOS device with the stacked gate dielectric of Hf-TiON/ZnON plus NH3-plasma treatment. These improvements could be ascribed to the fact that the ZnON IPL can effectively block in-diffusion of oxygen atoms and out-diffusion of Ga and As atoms, and the NH3-plasma treatment can provide not only N atoms but also H atoms and NH radicals, which is greatly beneficial to removal of defective Ga/As oxides and As-As band, giving a high-quality ZnON/GaAs interface. The GaAs MOS capacitor was fabricated with HfTiON as high-k gate dielectric and NH3-plasma-treated ZnON as interfacial passivation layer (IPL), and its interracial and electrical properties are investigated compared to its counterparts with ZnON IPL but no NH3-plasma treatment and without ZnON IPL and no plasma treatment. Experimental results show that low interface-state density near midgap (1.17×10^12 cm^-2eV^-1) and small gate leakage current density have been achieved for the GaAs MOS device with the stacked gate dielectric of Hf-TiON/ZnON plus NH3-plasma treatment. These improvements could be ascribed to the fact that the ZnON IPL can effectively block in-diffusion of oxygen atoms and out-diffusion of Ga and As atoms, and the NH3-plasma treatment can provide not only N atoms but also H atoms and NH radicals, which is greatly beneficial to removal of defective Ga/As oxides and As-As band, giving a high-quality ZnON/GaAs interface.

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机构 中山大学
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