作　　者： (林德育）; (肖曙红）; (麦智伟）;

机构地区： 广东工业大学机电工程学院,广州510006

出　　处： 《现代制造工程》 2017年第9期133-138,共6页

摘　　要： 针对SOP封装贴片元件的成像特点,为了限制目标区域的数量,减少计算元件角度的运算量,首先采用基于最小外接矩形算法快速获取目标区域的中心坐标、近似面积及近似周长,以矩形面积和周长为限制条件搜索出目标矩形并计算出元件实际中心;然后结合基于邻接矩阵的搜索算法搜索出单排目标矩形的中心;最后通过最小二乘法拟合直线计算出元件的角度。该方法简单高效,有效地减少了元件识别过程中的运算量。实验结果表明,该算法在保证对SOP元件高精度定位的同时,可实现高效率的贴装。 Based on the imaging feature of SOP components, in order to limit the number of the target area, reduce the computing element angle computation, adopting the algorithm of minimum enclosing rectangle to quickly gain the center coordinates, the ap- proximate area and the approximate perimeter of the target areas, searching out the destination rectangle and calculate the actual center element based on rectangular area and perimeter constraints. Then searching out the single target in the center of the rec- tangle based on adjacency matrix search algorithm. Finally calculated the center of elements by least squares fitting line . The method is simple and efficient, effectively reduce the computational complexity in the process of element identification. The experimental results show that the algorithm is to ensure high precision positioning for SOP, and at the same time, it can realize high efficiency of component placement.

关 键 词： 最小外接矩形 算法 邻接矩阵 最小二乘法