导　　师： 郝丽娜

学科专业： 0852

授予学位： 硕士

作　　者： ;

机构地区： 东北大学

摘　　要： 晶圆预对准是半导体制造的重要环节之一,预对准机用来检测晶圆的偏心及缺口/(或切边/)并实现单个晶圆的定位以及晶圆之间的一致性,对半导体制造精度的保证起到了重要作用。随着晶圆尺寸的提高,对晶圆预对准的精度要求也相应提高,因此,有必要对晶圆预对准的相关技术进行系统研究。 本文主要工作如下： /(1/)首先采用分段函数法对晶圆边缘曲线进行建模,再根据几何关系分段建立晶圆边缘数据采集模型。根据所采集到的晶圆边缘数据分别采用不同算法计算出晶圆的偏心及缺口的方向。 /(2/)在建立晶圆边缘数据采集模型的基础上,采用适当的算法对晶圆的偏心及缺口位置进行计算,并将计算结果与设定的实际晶圆偏心及缺口位置进行对比,得到计算误差。对不同条件下的仿真结果进行对比,研究晶圆预对准过程中各参数对其精度的影响规律。 /(3/)根据误差精度分析结果,利用误差转化的方法将预对准机自身误差转化成预对准机与机械手相对坐标系误差,从而实现预对准机自身与相对坐标系的综合标定。结合晶圆预对准系统自身的检测系统设计预对准系统综合标定方案。 /(4/)对实际预对准机进行设计,并对其机械本体及电气部分的有关精度进行测试以弥补仿真分析的不足,根据得到的测试结果来衡量晶圆预对准系统的相关性能,针对不满足要求的部分给出改进建议。 Wafer Pre-alignment plays an important role in semiconductor manufacture. Pre-aligner detects wafer eccentricity and wafer notch /(or flat/) in order to position individual wafer and to improve consistency among wafers in one cassette, which ensures high accuracy in semiconductor manufacturing process. As the wafer size increases, pre-alignment accuracy requirements have been increased. Thus, research of wafer pre-alignment technique becomes necessary. The main research works are as follows: /(1/) First establish the model of wafer edge curve using piecewise function and then establish wafer edge data acquisition model of each segment. After that, calculate wafer eccentricity and notch direction using different algorithms based on the collected data of wafer edge. /(2/) Comparing the calculated eccentricity and notch position of the wafer with the preset value based on wafer edge data acquisition model, calculation error is achieved. According to the results under different condition, systematically study the regulation of impact of each parameter on wafer pre-alignment accuracy and achieve important conclusions related to the control, calibration and compensation of the error. /(3/) According to the error analysis result, transfer the error of pre-aligner into the error of the coordinate relationship between pre-aligner and the robot using error transformation method. With the method, achieve calibration of both errors in one process simultaneously. Then, different calibration methods are designed. /(4/) Test the accuracy of both mechanical and electrical parts of actual pre-aligner to Compensate for the deficiencies of simulation analysis. Measure the performance of wafer pre-alignment system, and then suggest improvement method according to the weak parts.

关 键 词： 制造 晶圆预对准 建模仿真 误差分析 标定

领　　域： [电子电信]