导　　师： 李团结;欧萌

学科专业： 0802

授予学位： 硕士

作　　者： ;

机构地区： 西安电子科技大学

摘　　要： 在集成电路元件的生产制造过程中,IC引线框架是一种主要的辅助材料,它给IC芯片提供了支撑的基座,并提供焊接的引线及导脚。为了保证封装工艺中的装片//键合性能,使芯片和金丝与引线框架形成良好的扩散焊接,引线框架的装片//键合区域/(内引线脚上和小岛/)一般要求压印,然后在上面镀银,为芯片提供了一个良好的键合点区域。 引线框架选择镀银是IC后道封装中的一个关键工序,因此要求很高的成品率和可靠性,即镀层质量要求要符合装片与键合要求。 本文以引线框架镀银生产线的研制为基础,介绍了设备的关键部件选择镀机,主要分析了其中影响镀层质量的关键结构——喷镀装置。运用先进的Fluent软件求解分析喷镀装置中镀液的流场参数,找出影响镀层质量的结构设计因素。 通过分析在喷镀装置中溶液流场的速度、流向、压力等参数,提出对喷镀装置的结构改进。并且经过实验验证,喷镀装置的改进提高了镀层的均匀性,保证了镀层质量。 IC lead frame is a main sort of assistant materials during the IC manufacture process. It is the groundwork for installing chips, offering leads for jointing. Lead frame's bonding area is currently pressed mark, silver electroplating for ensuring bonding performance of package technology. In this way, we can get a very complanate bonding area for chip. It is required a very high finished product rate and reliability because part electroplating on lead frames is a key procedure in IC package. Namely the quality of plating-layer is required according with the need of packing and bonding. This dissertation introduces the key component-part plating equipment on the basis of development of IC lead frame part silver plating product line. It mainly analyses the key part of the part plating equipment,namely spray plating set which affects the quality of the plating-layer. It also analyses and solves the flow field parameters of spray plating set by using advanced software-Fluent. The structure design factor of affecting plating-layer quality is found. The improvement for the spray plating set is proposed by analyzing the velocity, flow path, pressure of plating solution in it. Experiments verify that the amelioration improves the uniformity and ensures the quality of the plating-layer.

关 键 词： 引线框架 镀银 喷镀装置 流场分析 镀层均匀性

分 类 号： [TQ153.16]

领　　域： [化学工程]