作　　者： ; ; ; ; ; ; ;

机构地区： 中国科学院金属研究所

出　　处： 《金属学报》 2004年第7期745-748,共4页

摘　　要： 利用电弧离子镀技术在SiCp/2024Al基体上制备(Ti,Al)N涂层.研究了偏压对涂层的相组成、晶格常数和成分的影响及不同过渡层对涂层与基体结合性能的影响.结果表明,在较小偏压下, (Ti,Al)N涂层呈(111)择优取向;偏压在-150 V时,涂层无择优取向;但随偏压继续升高,出现(200)和(220)择优取向.在添加Ti过渡层时,涂层与基体形成致密均匀的良好结合.同时通过设计梯度涂层,获得了厚度达105μm的无裂纹(Ti,Al)N涂层. (Ti,AI)N coatings with interlayers were deposited on SiCp/2024Al composites by arc ion plating at different negative bias voltages. The phase constitution, lattice constant and the composition of the coatings prepared at different negative bias voltages were analyzed. It is shown that (Ti, Al)N coatings have preferred orientation changed from (111) to (200) and (220) with increasing of negative bias voltage. The coating with Ti interlayer exhibits well adherence to the substrate compared with TiAl interlayer. To gain thick coating with 105 mum, the (Ti, Al)N coating with a gradient nitrogen component was designed.

关 键 词： 涂层 复合材料 电弧离子镀 偏压 相组成 晶格常数

领　　域： [一般工业技术] [金属学及工艺] [金属学及工艺]