作　　者： ; ; ;

机构地区： 华南理工大学机械与汽车工程学院

出　　处： 《机械工程材料》 2004年第4期19-21,共3页

摘　　要： 在Ni-P化学镀的基础上探讨了在塑料基体上化学镀Ni-Cu-P三元合金的镀液成分及其工艺条件。试验表明:当络合剂摩尔分数为镍离子摩尔分数的2倍以上时,可在塑料上实现镍、铜共沉积,得到较好的Ni-Cu-P镀层。并对镀层结构、成分与电阻率、结合力的关系进行了讨论。 The bath composition and plating conditions of electroless Ni-Cu-P deposits on engineering plastics were studied based on electroless Ni-P plating.The experiment results show that nickel and copper can be co-deposited and good Ni-Cu-P coating can be achieved when the content of the complexing agent is above two times that of the nickel salt.The effects of the structure and composition of the deposits on the electrical resistivity and adhesion of the deposits were discussed.

关 键 词： 工程塑料 化学镀 结合力 电阻率

领　　域： [一般工业技术] [化学工程]