机构地区: 华北工学院电子信息工程系
出 处: 《微纳电子技术》 2003年第7期235-237,共3页
摘 要: MEMS中的封装工艺与半导体工艺中的封装具有一定的相似性 ,因此 ,早期MEMS的封装大多借用半导体中现成的工艺。本文首先介绍了封装的主要形式 ,然后着重阐述了晶圆级封装与芯片级封装[1] 。 MEMS is a relatively new field which is tied so closely with silicon processing that most of the early packaging technologies will most likely use ”off the shelf” packaging ”borrowed” from the semiconductor microelectronics field. In this paper, the present packaging types are first introduced, and then elaborated the CSP(chip scale package) which is the cost effective replacement for the traditional hermetic package, finally, some commercial packages for MEMS devices are given.
领 域: [电子电信]