机构地区: 广东工业大学材料与能源学院
出 处: 《广东工业大学学报(社会科学版)》 2003年第B06期183-185,共3页
摘 要: 对应用在电子行业中的合金电镀和复合技术的现状作了简要的综述 ,并分析电镀技术变革的主要原因 。 In this paper, the present situation of electroplating technology in the field of electronic industry is summarized. And the author discusses the reasons of the reform as well as analyses the requirement of the technology in the 21st century.