作　　者： ; ; ;

机构地区： 华南理工大学食品与生物工程学院

出　　处： 《食品科技》 2003年第5期16-18,共3页

摘　　要： 采用差示扫描量热分析技术(DSC)对原淀粉及各抗性淀粉样品的糊化温度及糊化热效应进行了测试和研究。DSC吸热曲线显示,经处理过的样品晶体完全不同于原淀粉晶体。抗性淀粉的吸热曲线除了在85℃左右出现一个小峰外,在125℃左右又开始出现吸热峰,相变高峰温度约在155℃。随着样品中抗性淀粉含量的升高,曲线中第二吸热峰的相变焓逐渐升高,相变高峰温度也遵循同样的规律。 Differential Scanning Calorimeter(DSC) was used to determine the gelatinization temperature and enthalpy of corn starch and resistant starch(RS) in this paper. The DSC curves indicated that there was evident difference between the crystal of corn starch and RS. Besides a small peak at about 85℃ being on the DSC curves of RS, another peak began to appear at about 125℃, and the peak temperature of transformation was about 155℃. The transformation enthalpy of the second peak increased gradually with the enhancement of the RS content in the samples, and the transformation peak temperature was also accorded with this law.

关 键 词： 抗性淀粉 糊化温度 糊化焓

领　　域： [轻工技术与工程] [轻工技术与工程]