作　　者： ; ; ; ;

机构地区： 湖南大学电气与信息工程学院

出　　处： 《焊接学报》 2014年第8期30-34,42,114,共7页

摘　　要： 焊点表面三维重建是微组装质量三维检测与控制技术的重点研究内容之一.焊点图像中存在的高亮区,使得微电子组装焊点表面三维重建成为难点问题.为解决此问题,通过分析焊点表面光照反射项,结合焊点图像的特点,依据光照反射原理,推导焊点表面反射光照反射模型;通过分析图像中高亮区的形成原理,提出一种改进的微组装焊点表面三维重建算法.结果表明,与基于其它传统光照反射模型的三维重建方法相比,采用提出的三维重建算法可解决微组装焊点三维重建失真问题,重建出的焊点三维形状更加理想. Solder joint three-dimensional( 3D) reconstruction is one of the key research of microelectronic assembly quality 3D detection and control technology development. During the solder joint 3D reconstruction based on SFS theory,its 3D reconstruction becomes one of the key problems because of existing'high light area'on solder joint surface. In order to resolve the problem,at first,by analyzing the reflection items on solder joint surface,a reflection model is got for microelectronics solder joint according to the characteristics of joint surface and solder joint image. Then,by analyzing the formation principle of'high light area'and modifying the reconstruction result,an improved3 D reconstruction algorithm is proposed for microelectronics assembly solder joint. At last,the experimental results have shown that the'distortion'can be solved and the 3D shape based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.

关 键 词： 焊点 微电子组装 三维重建 阴影恢复形状算法

领　　域： [金属学及工艺]