作　　者： ; ; ; ;

机构地区： 中南大学机电工程学院

出　　处： 《工程塑料应用》 2017年第2期60-63,共4页

摘　　要： 建立了聚甲基丙烯酸甲酯(PMMA)的黏弹性材料模型,利用有限元仿真软件Abaqus,以填充率为质量评价标准,对微流控芯片热压印的填充过程进行仿真。研究在等温条件(模具与芯片温度相同)下时间、温度和压力对微流控芯片沟槽填充效果的影响。仿真结果表明,压印温度和压印力对PMMA聚合物填充效果的影响较大,提高温度和压力都能达到加快聚合物填充速率和提高复制率的作用;时间参数的影响主要体现为增大PMMA的应力松弛现象,延长压印时间同样能达到提高复制率的作用。 The viscoelastic material model of the polymethyl methacrylate(PMMA)was established. The replication rate of the microstructure was set as the judging basis,and the filling process of microfluidic chip during hot embossing was studied by finite element simulation software Abaqus. The influence of time,temperature and force in the filling result were studied under isothermal conditions.The results show that the temperature and force of embossing have a great effect on the filling ratio,and both increasing the temperature and force can achieve the result of accelerating polymer filling rate and increasing the rate of replication. The effectof time is mainly reflected by the stress relaxation of PMMA and the filling rate also can be increased by extending the embossing time.

关 键 词： 聚甲基丙烯酸甲酯 热压成型 黏弹性 填充率 仿真

领　　域： [化学工程]