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电工硅钢晶粒尺寸和取向对圆盘剪分切断面硬化的影响
Influence of Grain Size and Orientation of Electrical Silicon Steel on Work Hardening in the Disc Slitting

作  者: ; ; ; ; (邱炫锋);

机构地区: 广东工业大学机电工程学院

出  处: 《广东工业大学学报》 2017年第1期55-59,共5页

摘  要: 针对不同晶粒尺寸和取向的电工硅钢进行圆盘剪分切加工试验,通过金相组织观察和显微硬度测试分析了分切断面组织形貌变化及加工硬化行为.金相观察发现,分切加工前后金相组织差异较大,晶粒尺寸越小变形越大,晶粒尺寸较大时容易产生穿晶断裂,并伴随有明显的孪晶组织.电工硅钢的晶粒尺寸和取向对加工硬化影响很大,在晶粒尺寸相近时,无取向硅钢的加工硬化程度明显大于取向硅钢,晶粒取向相同的材料,晶粒尺寸越大,硬度变化越明显.分切过程中的加工硬化程度与材料变形状态也直接相关,变形越激烈加工硬化越大.无取向硅钢内部晶粒取向由杂乱无章变得有序,大大提高了材料抵抗塑性变形的能力,硅钢晶粒较小时变形机制由位错滑移主导,晶粒较大时主要发生孪晶形变. Silicon steel sheets with different grain size and orientation are selected to conduct the disc slittingexperiment,and the slitting surface morphology and work hardening behavior are studied by analyzingmicrostructure morphology and micro-hardness.The difference of metallographic structure is great before and afterslitting:silicon steel with smaller grain size has larger deformation,while silicon steel with larger grain size is easyto generate the transgranular fracture along with obvious twin structure.The grain size and orientation of siliconsteel have a great influence on work hardening.When the grain size is close,the work hardening ability of the nonorientedsilicon steel is bigger than that of the grain-oriented silicon steel.When grain orientation of silicon steel isthe same,the larger the grain size,the bigger the changing of hardness.The degree of work hardening is directlyrelated to the material deformation in the disc slitting.The fiercer the deformation,the larger the work hardening.Grain orientation of non-oriented silicon steel becomes orderly,which greatly improves the ability to resist plasticdeformation.Deformation mechanism of fine granular material is dominated by dislocation slip and the twindeformation mainly occurs in large granular silicon steel.

关 键 词: 电工硅钢 晶粒尺寸 晶粒取向 加工硬化 圆盘剪分切

领  域: [自动化与计算机技术] [自动化与计算机技术]

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