作　　者： ; ; ; ; ; ; ; (郭建军）; (陈植鹏）;

机构地区： 深圳大学材料学院

出　　处： 《材料热处理学报》 2015年第8期17-21,共5页

摘　　要： 分别使用抗坏血酸和水合肼还原Ag NO3和Cu SO4的混合液,改变溶液浓度、配比和反应温度,制备超细银铜不融合金粉末。使用X射线衍射仪（XRD）、扫描电子显微镜（SEM）、热重分析仪（TG）对合金粉末进行表征。合金粉末用于制备导电胶进行导电性测试,并进行合金粉末的抗菌性实验。结果表明：使用抗坏血酸和水合肼为还原剂分别制得粒径为463~871 nm和25.9~63.5 nm的合金粉末,抗坏血酸法制备的合金粉末抗氧化性更好,且其相应制得的导电胶导电性更优,而水合肼法制备的合金粉末抗菌性更强。 The mixed liquor of AgNO3 and CuSO4 was reduced by ascorbic acid or hydrazine hydrate. By changing the concentration, proportion and reaction temperature, the uhrafine Ag-Cu immiscible alloy powder was prepared successfully. The alloy powders were characterized by X-ray diffraction （XRD） , scanning electron microscopy （SEM） and thermogravimetric analyzer （TG）. The alloy powder was used for the preparation of conductive adhesive and its electrical properties were tested. The antibacterial experiments were also carried out. The results show that immiscible alloy powders which is reduced by ascorbic acid and hydrazine hydrate have particle diameters of 463- 871 nm and 25.9-63.5 nm, respectively. The alloy powder which is reduced by aseorbic acid has stronger resistance to oxidation and better electrical conductivity, meanwhile the alloy powder which is reduced by hydrazine hydrate has stronger antibacterial property.

关 键 词： 超细银铜不融合金粉末 抗氧化性 导电性 抗菌性

领　　域： [一般工业技术]