作　　者： ; ; ; ;

机构地区： 中山大学化学与化学工程学院

出　　处： 《物理化学学报》 2001年第3期206-209,共4页

摘　　要： 研究了在二甲基甲酰胺 (DMF)体系中钬的电还原及钬与镍的电解共沉积 .结果表明，由于微量水在电极上还原形成不溶的导电性差的膜层，使钬单独沉积很困难 .恒电位电解用于制备钬镍合金， EDAX,SEM和 XRD用于分析镀层，得到了黑色粘附性好的非晶态钬镍合金镀层，钬的含量可高达 72.7％ . Cyclic voltammetry was used to study the electroreduction of Ho(III) in Ho(NO3)(3)-LiClO4-DMF. The results showed that traces of water in this system blocked the electroreduction of Ho(III) by forming LiOH and Ho(OH)(3) films on the electrode surface. Co-deposition of Ho and Ni was studied in dimethylformamide by cyclic voltammetry and potentiostatic deposition at room temperature. Potentiostatic deposition was used to prepare Ho-Ni alloys. EDAX, SEM and XRD were used to analyze the films. The results indicated that black, adhesive and amorphous Ho-Ni alloy films on Cu were produced where the content of Ho could be as high as 72.7%.

关 键 词： 恒电位电解 二甲基甲酰胺 钬镍合金 电解共沉积 合金镀层

领　　域： [化学工程]