作　　者： ; ;

机构地区： 浙江大学机械工程学系

出　　处： 《浙江大学学报（自然科学版）》 2000年第6期637-641,共5页

摘　　要： 应用最小能量原理和有限元方法 ,建立塑料球栅阵列 (PBGA:Plastic Ball Grid Array)器件焊点三维形态预测模型 ,对 PBGA焊点三维形态进行预测和分析 .并将预测结果与试验结果以及国外学者用数学分析模型所得到的预测结果进行了对比验证 。 Minimal energy principle and finite element method were employed in modeling the solder joint shapes of Plastic Ball Grid Array(PBGA) device. And three\|dimensional solder joint shapes of PBGA device were predicted and analyzed. Comparisons are made between results predicted by the current model here and experimental measurements and those generated by mathematical analysis model at abroad, which show in good agreements.

关 键 词： 球栅阵列 焊点形态 最小能量原理 器件

领　　域： [金属学及工艺]