作　　者： ; ; ; ;

机构地区： 汕头大学工学院

出　　处： 《照明工程学报》 2013年第5期84-89,98,共7页

摘　　要： 本文介绍了目前大功率LED芯片的主要结构和大功率LED封装基板及散热技术的最新进展。结论是:LTCC陶瓷基板及AlSiC金属陶瓷复合基板是目前大功率LED基板的首选材料;同时,散热效果优异的散热器技术也相继推出,其中双压电冷却喷射技术(dual piezoelectric cooling jet)可能会极大的提高大功率LED散热的效率。 In this paper, the main chip structures for high-power LED were described. The development of package substrates and external heat dissipation techniques for high-power LED was introduced. LTCC substrate and A1/SiC substrate with excellent heat conduct performance was the main choice for high-power LED. Meanwhile, some external heat-sink system with excellent heat dissipation capability had been studied. The DPJ technique （dual piezoelectric cooling jet） should efficiently improve the heat dissipation for high power LED.

关 键 词： 大功率 基板 散热器

领　　域： [电子电信]