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紫外光-热混杂固化含硅树脂的性能研究
Study on the properties of UV-heat curable resin containing organosilicon

作  者: ; ; ; ; ;

机构地区: 深圳职业技术学院应用化学与生物技术学院

出  处: 《辐射研究与辐射工艺学报》 2013年第3期51-55,共5页

摘  要: 合成了一系列同时具有双键(光固化)和环氧基团(热固化)的有机硅改性丙烯酸环氧单酯,配制了光-热混杂固化体系。测试了有机硅链段长短对改性丙烯酸环氧单酯光-热混杂固化膜的凝胶率、吸水率、力学性能、体积收缩率和热性能的影响,结果表明:在相同稀释剂条件下,与丙烯酸环氧单酯光-热固化膜相比,有机硅改性丙烯酸环氧单酯光-热固化膜的凝胶率为97%左右,与未改性前相似,断裂强度有所下降,但断裂伸长率由4.8%提高到14.1%,体积收缩率由6.19%下降到4.93%,光-热固化膜的热分解温度有所增加。 A series of organosilicon modified epoxy monoacrylates (OMEMA) containing both C=C (UV-curable groups) and epoxy (heat-curable groups) were synthesized, and a number of UV-heat curable systems were prepared. The influence of the length of the organosilicon segment on the gel content, water absorption, me- chanical, volume shrinkage and thermal characterizations of UV-heat cured films using modified epoxy monoacrylates as resins were measured. Compared to the epoxy monoacrylates (EMA), UV-heat curable systems with the same active diluents, the gel contents of UV-heat cured films of OMEMA systems were about 97% and was simi- lar to the EMA systems. Its breaking strength decreased. However, the relative elongation UV-heat cured films of OMEMA systems increased from 4.8% to 14.1%, and volume shrinkage was decreased from 6.19% to 4.93%. The decomposition temperature of UV-heat cured films was increased.

关 键 词: 紫外光固化 热固化 改性 丙烯酸环氧单酯

领  域: [核科学技术]

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