帮助 本站公告
您现在所在的位置:网站首页 > 知识中心 > 文献详情
文献详细Journal detailed

聚乙二醇改性PET薄膜化学镀铜
Electroless copper plating on polyethylene glycol- modified PET film

作  者: ; ; ; ; (武守坤); (李柱梁); (邓剑锋);

机构地区: 广东工业大学轻工化工学院

出  处: 《电镀与涂饰》 2013年第1期25-28,共4页

摘  要: 研究了聚乙二醇改性对聚对苯二甲酸乙二醇酯(PET)薄膜化学镀铜的影响。主要工序为:依次用1#、3#、5#金相砂纸打磨PET薄膜,在紫外光下用聚乙二醇改性接枝,以及化学镀铜。镀液的组成与工艺条件为:CuSO4·5H2O 16g/L,Na2EDTA 14g/L,NaKC4H4O6·2H2O 19.5g/L,NaOH 14.5g/L,HCHO 15mL/L,温度40℃,时间30min。红外光谱图表明PEG-6000被成功接枝在PET薄膜表面。分别采用X射线衍射仪、扫描电镜分析了化学镀铜后PET薄膜的结构和表面形貌,并测试了PET薄膜的结合力、厚度、导电性等性能。结果表明,PET表面的化学镀铜层纯度高;与未改性PET基铜镀层相比,改性的PET基铜镀层结晶更细致、光亮;镀铜层的厚度、电导率、背光等级及其与PET薄膜之间的结合力分别为1.21μm、1.9×105S/cm、10级、16.1N/cm,可用以生产挠性电路板(FCB)。 The effect of polyethylene glycol (PEG-6000) modification of polyethylene terephthalate (PET) film on electroless copper plating on its surface was studied. The process flow mainly consists of: (a) successive polishing of PET film with 1#, 3# and 5# metallographic sand paper; (b) modification of PET film by grafting with PEG; and (c) electroless copper plating from a bath containing CuSO4·5H2O 16 g/L, Na2EDTA 14 g/L, NaKC4H406·2H2O 19.5 g/L, NaOH 14.5 g/L, and HCHO 15 mL/L at temperature 40 ℃ for 30 min. The infrared spectra show that PEG-6000 are grafted successfully to the surface of PET film. The structure and surface morphology of PET film before and after electroless copper plating were analyzed by X-ray diffractometer and scanning electron microscope, respectively, and the properties of PET film such as adhesion strength, thickness, and conductivity were tested. The results show that the electroless copper coating on PET film is highly pure. Compared to the copper coating on ungrafted PET substrate, the copper coating on grafted PET substrate is fine-grained and bright. The electrolessly plated copper coating on PEG-modified PET film features a thickness of 1.21 /am, a conductivity of 1.9 × 10^5 S/cm, a backlight level of 10 grade, and an adhesion strength of 16.1 N/cm, being able to be used to produce flexible circuit boards (FCBs).

关 键 词: 聚对苯二甲酸乙二醇酯 薄膜 聚乙二醇 改性 化学镀铜 挠性电路板

领  域: [化学工程]

相关作者

作者 邹芬
作者 周永生
作者 胡颉
作者 马伟

相关机构对象

机构 华南理工大学
机构 暨南大学
机构 华南理工大学轻工与食品学院制浆造纸工程国家重点实验室
机构 江苏科兴工程建设监理有限公司

相关领域作者

作者 余琳
作者 刘洋
作者 何慧
作者 危旭芳
作者 张振刚