作　　者： ; ; ; ; ;

机构地区： 广州大学机械与电气工程学院

出　　处： 《Transactions of Nonferrous Metals Society of China》 2011年第9期2066-2071,共6页

摘　　要： 制造一种新型大功率发光二极管(LED)相变热沉作为封装级散热元件,采用犁切?挤压成形的周向螺旋状微沟槽和采用冲压成形的放射状径向沟槽组成的三维结构作为蒸发面强化沸腾结构,内壁采用铜粉颗粒烧结而成的毛细芯结构为工质提供循环动力。测试了相变热沉在不同输入功率和工质条件下的运行特性。结果表明,相变热沉具有良好的传热能力,在环境温度为20°C,输入功率为10W的条件下,相变热沉最高温度为86.8°C,可满足功率为10W的LED封装散热需求。 A novel phase change heat sink was fabricated for packaging cooling of high power light emitting diode （LED）. 3D structures as enhanced boiling structure in the evaporation surface were composed of a spiral micro-groove along circumferential direction and radial micro-grooves which were processed by ploughing-extrusion （P-E） and stamping, respectively. Meanwhile, the cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. Operational characteristics were tested under different heat loads and refrigerants. The experimental results show that phase change heat sink is provided with a good heat transfer capability and the temperature of phase change heat sink reaches 86.8 ℃ under input power of 10 W LED at ambient temperature of 20 ℃.

关 键 词： 大功率发光二极管 相变热沉 强化沸腾 毛细芯 传热性能

领　　域： [金属学及工艺] [一般工业技术] [金属学及工艺]