机构地区: 广东工业大学材料与能源学院
出 处: 《材料工程》 2011年第9期29-32,38,共5页
摘 要: 在Sn-4.1X-1.5Cu-Ni焊料合金中添加0.05%(质量分数,下同)(La+Ce),对焊料/Cu焊点等温时效后其界面组织的变化规律以及界面金属间化合物的形成和生长行为进行分析研究,结果表明:随着等温时效时间的延长,Sn-4.1X-1.5Cu-Ni/Cu和Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/Cu IMC层厚度增加,其界面金属间化合物的增厚主要由扩散机制控制;在SnXCuNi焊料合金中添加0.05%(La+Ce)后,能有效抑制等温时效过程中界面IMC的形成和生长,从而提高了焊点的可靠性,其中Sn-4.1X-1.5Cu-Ni/Cu的生长速率为2.95×10-17m2/s,Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/Cu的生长速率为2.51×10-17m2/s。 The microstructure evolution and the behavior of the formation and growth of intermetallic compound(IMC) layer at the interface between Sn-4.1X-1.5Cu-Ni solder and Cu substrate after isothermal aging were studied.The results show that the thickness of IMC layers in Sn-4.1X-1.5Cu-Ni/Cu system and Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/Cu system increases with the increase of the aging time,and their growth is mainly controlled by diffusion mechanism.The addition of 0.05%(mass fraction)(La+Ce) into the Sn-X-Cu-Ni solder alloy effectively inhibits the formation and growth of IMC during the isothermal aging,which develops solder alloy with a high reliability.Intermetallic growth rate constant for Sn-4.1X-1.5Cu-Ni/Cu and Sn-4.1X-1.5Cu-Ni-0.05(La +Ce)/Cu is 2.95×10-17m2/s and 2.51×10-17m2/s,respectively.
关 键 词: 无铅焊料 稀土 等温时效 金属间化合物 生长速率
领 域: [金属学及工艺]