作　　者： ; ; ;

机构地区： 河南大学

出　　处： 《化学进展》 2011年第8期1644-1656,共13页

摘　　要： 纳米铜由于其独特的物理化学性质以及在光学、电子、催化、抗菌、润滑、聚合物填充改性等领域的广泛应用得到了人们越来越多的关注。近年来研究者已经利用多种合成方法制备了不同尺寸和形貌的铜纳米材料。本文综述了目前铜纳米材料的几种常用的制备方法,包括化学还原法、微乳液法、多元醇法、有机前驱体热分解法、电化学法等,评述了这些方法的优缺点。在化学还原法中配体对无机纳米材料的表面修饰起着至关重要的作用,因而我们详细介绍了不同分子配体在铜纳米材料尺寸和形貌控制以及表面功能化等方面的特点和作用。最后结合本课题组在纳米材料制备方面的工作,对铜纳米材料的发展进行了展望。 Copper nanomaterials have received considerable attentions in recent years because of their unique physico-chemical properties and widespread applications in various areas such as optics, electronics, catalysis, antibacterial, lubrication, and fillermodification of polymers and so on. Recently many methods have been exploited for the preparation of copper nanostructures with different sizes and shapes. In this paper, a comprehensive review is presented on the general preparation methods of copper nanomaterials, including chemical reduction method, microemulsion technique, polyol process, organic precurser thermal decomposition method, electrochemical method, etc.. Their advantages and disadvantages are discussed. While selection of proper ligands is critical to the surface-modification of nanomaterials, we give a detailed introduction to the features and functions of various molecular ligands in relation to the control of size and morphology as well as surface functionalization of Cu nanomaterials. Combining with our group work on the preparation of inorganic nanomaterials, the development trends of copper nanomaterials are also proposed.

关 键 词： 纳米铜 制备 表面修饰

领　　域： [理学] [理学] [一般工业技术]