作　　者： ; ; ; ; (袁晓焉）;

机构地区： 中南民族大学

出　　处： 《粘接》 2011年第7期69-72,共4页

摘　　要： 以多种氯硅烷单体为主要原料制备了低黏度端乙烯基超支化有机硅树脂,然后再与脂环族环氧树脂、甲基纳迪克酸酐混合获得无溶剂绝缘漆。采用红外光谱表征了端乙烯基超支化有机硅树脂的结构。用TGA、高压电桥等测试了无溶剂绝缘漆的介电损耗因子、介电强度等绝缘性能。结果表明该无溶剂绝缘漆在155℃、180℃、200℃和220℃的介电损耗分别为:0.72%、1.18%、1.60%和2.53%,介电强度达到29.22kV/mm,挥发分质量分数低于5%。 A novel low-viscosity vinyl-ended hyperbranched organosilicon resin is synthesized from some chlorsilanes as the main materials in the paper, and its solvent-free insulating varnish also is prepared by mixing alicyclic epoxy resin and methyl nadic anhydride. The structure of vinyl-ended hyperbranched organosilicon resin is characterized by FT-IR. TGA and High Voltage Bridge are used to test the dielectric loss factor and the breakdown voltage of the solvent-free insulating varnish. And the dielectric loss of solvent-free insulating varnish are 0.72%, 1.18%, 1.60%, 2.53% at 155℃？180℃？200℃？220 ℃？V/mm and less than 5%.

关 键 词： 超支化聚合物 有机硅树脂 无溶剂绝缘漆 制备

领　　域： [化学工程]