机构地区: 陕西科技大学造纸工程学院
出 处: 《中华纸业》 2011年第14期11-14,共4页
摘 要: 采用透射电镜(TEM)对芳纶纤维/浆粕界面特征进行表征,探讨了界面微观结构与芳纶纸基材料综合性能的相关性。TEM观察结果表明,不同制造工艺的纤维,其微细纤维的精细程度有较大差异;热压过程并没有使得芳纶微纤维间熔融为一体,而是在纤维与基体间形成一个相互交叉的过渡区界面。界面的结构也不尽相同,纤维与浆粕间界面结构或形成镶嵌的"钉扎型",或形成"间隙型"界面。这些结构对纤维与浆粕间的结合性能造成明显差异,因而对纸张物理性能也有明显的影响。 The interface microstructure between the aramid fibre and fibrids was observed and characterized by using transmitting electric microscopy(TEM).The correlation between interface microstructure and aramid paper base material was discussed.The results show that there are large differences in texture delicates degree of micro-fibrills among fibers for various manufacturing processes.Surface micro fibers of aramid fiber and fibrids are not melted together in hot press process,a transition zone of interface is formed between fiber and matrix.Interfacial characteristics are also diverse,structures of "pinning-type" or "gap-type".These interfacial textures may have great effect on the bonding properties between fiber and fibrids.The structures have influence on physical properties in aramid paper sheets.