作 者: ;
机构地区: 韩山师范学院物理与电子工程系
出 处: 《韩山师范学院学报》 2011年第3期37-41,共5页
摘 要: 利用等离子体增强化学气相沉积(PECVD)技术,淀积a-SiNx/nc-Si/a-SiNx不对称双势垒存储结构.通过电容和电导测试研究结构的界面态特性.实验结果表明,采用PECVD方法制备的不对称存储结构的界面特性良好,其界面态密度为3×1010 cm-2eV-1. The a-SiNx/nc-Si/a-SiNx sandwiched structures are fabricated in a plasma enhanced chemical vapour deposition (PECVD) system on n-type Si substrate. The interface characteristic of the a-SiNx/nc-Si/ a-SiNx sandwiched structure was studied by the capacitance-voltage and conductance-voltage measurenent. The experimental results demonstrate that the interface of the sandwiched structure fabricated by PECVD technique has good quality. The interface density of the structure is calculated to he 3×10^10cm^-2eV^-1 by the capacitance and conductance method.