作　　者： ; ; ; ;

机构地区： 华中科技大学机械科学与工程学院数字制造与装备技术国家重点实验室

出　　处： 《华中科技大学学报（自然科学版）》 2011年第6期87-90,共4页

摘　　要： 以FC倒装芯片振动模型为基础,阐述了利用固有频率变化进行芯片缺陷检测的原理.通过COMSOLMultiphysics软件对周边型FC芯片的前5阶模态进行了仿真分析,结果显示焊点缺失会引起FC芯片高阶固有频率的明显变化.利用基于空气耦合超声激励的FC芯片缺陷检测方法,对焊点缺失FC芯片的振动速度进行了测量,提取出了FC芯片的前5阶固有频率,测量结果与仿真结果一致,验证了该方法检测FC芯片缺陷的可行性. Based on the vibration model of flip chip （FC）, a fault detection principle using the change of FC natural frequency was investigated. The first 5 order vibration modes of FCs with peripheral bumping solder were analyzed using COMSOI. Multiphysics software. The simulation result shows that solder bumping missing can lead to the significant change for high order natural frequencies. A fault detection method of FC was proposed based on air-coupled ultrasound excitation. By measuring the vibration velocity of FC, the first 5 frequencies of defective FCs were extracted. The measurement results agree with the simulation ones, which validates the feasibility of the defect inspection method.

关 键 词： 空气耦合 超声激励 倒装芯片 固有频率 缺陷检测

领　　域： [自动化与计算机技术] [自动化与计算机技术]