作　　者： ; ; ; ; (胡新嵩）;

机构地区： 华南理工大学材料科学与工程学院

出　　处： 《有机硅材料》 2011年第3期141-144,共4页

摘　　要： 以端乙烯基硅油为基胶、三氧化二铝(Al2O3)为主导热填料,并添加少量β-碳化硅晶须(SiCw),制备了导热有机硅电子灌封胶,研究了SiCw用量对灌封胶性能的影响。结果表明,添加少量SiCw能有效提高灌封胶的热导率,并提高其拉伸强度、扯断伸长率和硬度,但黏度有所上升。当SiCw用量为填料总质量的5%时,灌封胶的热导率从0.565 W/m.K提高到0.623 W/m.K,提高了10.3%;拉伸强度从1.23 MPa提高到1.5 MPa,提高了22%,黏度为5 800 mPa.s。扫描电镜显示,添加SiCw有利于形成导热通路、增加与基体的界面结合力,从而提高灌封胶的热导率和拉伸强度。 Thermal conductive silicone encapsulant was prepared with vinyl silicone oil as matrix,Al2O3 as the main thermal conductive filler,and β-silicon carbide whisker（SiCw）.The effects of the amount of SiCw on properties of silicone encapsulant were studied.The results showed that the addition of SiCw could not only increase the thermal conductivity of the silicone encapsulant,but also increase its tensile strength,elongation at break and hardness,but the viscosity increased.When the amount of SiCw was 5 wt% of the total filler,the thermal conductivity of encapsulant increased 10.3 %,from 0.565 W/m·K to 0.623 W/m·K;the tensile strength increased 22%,from 1.23 MPa to 1.50 MPa;and the viscosity was 5 800 mPa·s.SEM showed that the addition of SiCw was favorable to the formation of the passage for heat conduction and increasing the interface adhesion between the filler and matrix,thus increasing the thermal conductivity and tensile strength of the encapsulant.

关 键 词： 有机硅 乙烯基硅油 导热 灌封胶 碳化硅晶须

领　　域： [化学工程]