作　　者： ; ; ; ; (胡新嵩）;

机构地区： 华南理工大学

出　　处： 《有机硅材料》 2010年第5期283-287,共5页

摘　　要： 采用端乙烯基硅油为基胶、含氢硅油为交联剂、三氧化二铝(Al2O3)为导热填料,制备了导热有机硅电子灌封胶。研究了Al2O3的粒径及用量、不同粒径Al2O3并用和硅烷偶联剂对灌封胶性能的影响。结果表明,Al2O3的粒径越大,灌封胶的热导率越大,但拉伸强度和扯断伸长率减小,适合的Al2O3粒径为5μm或18μm;随着Al2O3用量的增加,灌封胶的热导率、拉伸强度增大,扯断伸长率先增后减,但黏度上升,Al2O3适合的加入量为150～200份;将不同粒径的Al2O3并用填充到灌封胶中可以提高灌封胶的热导率,当18μm Al2O3和5μm Al2O3的质量比为120∶80时,灌封胶的热导率达到0.716 W/(m.K),且对灌封胶的黏度和力学性能基本没影响;加入KH-570可改善灌封胶的力学性能,但热导率有所下降,适宜的用量为Al2O3质量的0.5%。 Thermal conductive silicone encapsulant was prepared with vinyl silicone oil as matrix,organohydrogenpolysiloxane as crosslinking agent and Al2O3 as thermal conductive filler.The influence of particle size and amount of Al2O3,combination of different particle sizes of Al2O3 and silane coupling agent on properties of silicone encapsulant were studied.The results showed that the thermal conductivity of encapsulant increased,the tensile strength and elongation at break decreased with the increase of the particle size of Al2O3,and the suitable particle size of Al2O3 was 5 μm or 18 μm.The thermal conductivity,tensile strength of encapsulant increased with the increase of the amount of Al2O3,while the elongation at break increased at first and then decreased,and the suitable amount of Al2O3 was 150～200 phr.The encapsulant filled with Al2O3 of different particle size exhibited higher thermal conductivity as compared with the encapsulant filled with Al2O3 of only one particle size,the thermal conductivity of encapsulant could reach 0.716 W/（m·K）when the mass ratio of 18 μm Al2O3 and 5 μm Al2O3 was 120∶80 and had almost little effect on viscosity and mechanical properties;the mechanical properties of silicone encapsulant improved with addition of coupling agent KH-570,but the thermal conductivity decreased.

关 键 词： 导热 灌封胶 端乙烯基硅油 甲基丙烯酰氧基丙基三甲氧基硅烷

领　　域： [化学工程]