作　　者： ; ; ; ; ;

机构地区： 华南理工大学电子与信息学院

出　　处： 《微纳电子技术》 2010年第8期507-512,共6页

摘　　要： 采用在线监测技术对高密度封装IC样品进行温度步进试验、温度循环试验和振动步进试验等高加速应力试验,确定了产品的耐受应力极限,验证了本试验方案和试验监测技术的有效性和可行性。通过失效分析,确定了高加速应力下电路的失效模式和失效机理。结果表明：高密度塑封IC元件在高加速温循应力下比在随机振动应力下失效更为集中,温循试验在-65~165℃温度范围内,失效显著且集中在3个循环以内,主要包括塑封料和引线框架、基板的分层以及内键合点脱离,样品耐受随机振动量级超过50grms。研究结果可为器件级高加速应力试验研究提供参考。 The highly accelerated stress test,including the temperature step test,temperature cycle test and vibration step test,were carried out for high-density packaging ICs with the online monitoring technology.The stress tolerance limits of the products were determined.The effectiveness and feasibility of the experimental project and online monitoring technique were verified.Through the failure analysis,the failure mode and failure mechanism were determined under the highly accelerated stress.The results show that more failures expose in highly accelerated temperature cycling stress test than that of in highly accelerated random vibration stress test for high density plastic packaging ICs.In the temperature cycling test,the obvious failures appear and concentrate in the temperature range of-65-165 ℃ and within 3 cycles.The failures mainly include the delamination between the plastic materials and lead frame,the delamination between the plastic materials and substrate,and the detachment of inner bondings.The tolerance magnitude of the random vibration for the samples is more than 50 grms.The research results provide a reference for the highly accelerated stress test in device class.

关 键 词： 高加速应力试验 在线监控 温度循环 振动步进 失效模式

领　　域： [电子电信]