机构地区: 广东工业大学机电工程学院
出 处: 《热加工工艺》 2010年第10期90-94,共5页
摘 要: 讨论印刷电路板(PCB)复合材料高速钻削刀具的磨损机制,分析PCB高速钻削刀具的磨损形态,总结PCB微钻材料的发展。提出PCB高速微钻刀具材料选择的基本要求,目的是延长PCB刀具寿命,提高PCB高速微钻孔质量。 The wear mechanism of high speed drilling tool used for printed circuit board(PCB) composite s was discussed.The wear modalities of high speed drilling tool were analyzed.The development of micro-drilling materials was summarized.The basic demand of choosing material of high speed drilling tool used in PCB was put forward.The aim was to prolong the lifespan of PCB cutting tool and enhance the quality of PCB small hole drilling.
关 键 词: 印刷电路板复合材料 高速钻削 磨损机制 磨损形态
领 域: [一般工业技术]