作　　者： ; ;

机构地区： 桂林电子工业学院机电工程学院机械电子工程系

出　　处： 《Journal of Semiconductors》 1999年第1期47-52,共6页

摘　　要： 本文基于最小能量原理建立了塑料球栅阵列（ＰＢＧＡ）焊点形态成形模型，运用有限元方法预测ＰＢＧＡ焊点形态，并对预测结果与其它不同模型的预测结果和实验结果进行了对比．结果表明，有限元方法预测结果与其它模型结果和实验结果吻合良好． Abstract In this paper, solder joint shapes evolving model of plastic ball grid array based on minimal energy principle is developed, the finite element method is employed to predict solder joint shapes of PBGA. Comparisons are made between the joint heights predicted by the current model here and those generated by other various models. The results show that the predicted results of current model are identical to that of other various models and in excellent agreement with experimental measurements.

关 键 词： 球栅阵列 封装 器件 半导体器件

领　　域： [电子电信]