作　　者： ; ; ;

机构地区： 华南理工大学机械与汽车工程学院

出　　处： 《焊接技术》 2010年第3期1-5,共5页

摘　　要： 随着电子产品向微型化、多功能化的发展,封装焊点尺寸逐渐减小,电流密度急剧增大,由电迁移引起的焊点失效问题也日趋严重。电迁移使焊点的阳极产生凸起、挤出、晶须,甚至产生塑性变形,阴极产生空洞、裂纹,降低焊点的可靠性,导致电路短路或者断路,使元器件快速失效。本文介绍了近期国内外有关Sn-Cu,Sn-Ag,Sn-Ag-Cu,Sn-Zn及Sn-Bi等无铅钎料电迁移现象的研究进展,并分析、评述了电迁移对无铅钎料焊点可靠性的影响机制。 With the development of miniaturization and multi-functionality of electronic products,the feature size of packaging joints was getting smaller and the current density was increased sharply.So,the failure problem of solder joints induced by electromigration was getting more and more seriously.The electromigration in the solder joints induced the accumulation of hillocks,extrusion,whiskers and even plastic forming in the anode,voids and cracks in the cathode.It decreased the reliability of the solder joints and lead to short circuit or open circuit which made the electronic products failing rapidly.This paper introduced the currently study of electromigration on lead-free solder of Sn-Cu,Sn-Ag,Sn-Ag-Cu,Sn-Zn and Sn-Bi both at home and abroad,the effect mechanism of electromigration on the reliability of lead-free solder joints was also analyzed and commented.

关 键 词： 电子封装 无铅钎料 电迁移 可靠性

领　　域： [金属学及工艺]