作　　者： ; ; ;

机构地区： 华南理工大学机械与汽车工程学院

出　　处： 《焊接技术》 2009年第12期42-45,共4页

摘　　要： 为降低Sn-Ag-Cu系无铅钎料中Ag的含量以减少钎料的成本,对Sn-xAg-0.7Cu(x=0.5,1.0,1.5,3.0)及Sn-0.5Ag-0.7Cu-yBi(y=1,3,5)无铅钎料在不同钎焊温度和不同钎剂活性条件下,进行了钎焊润湿性试验,分析了不同Ag含量、Bi含量对润湿性的影响。试验结果表明:在Sn-Ag-Cu系无铅钎料中,随着Ag含量的降低,钎料的润湿性降低;随着Bi含量的增加,钎料的润湿性提高。 In order to cut down the cost of Sn-Ag-Cu solder by reducing the content of Ag in the lead-free solder,the soldering wettability test for Sn-xAg-0.7Cu x=(0.5,1.0,1.5,3.0,wt%) and Sn-0.5Ag-0.7Cu-yBi (y=1,3,5,wt%) was carried out under the condition of different temperature and flux activity,analyzing the influence on the wettability by the different contents of Ag and Bi addition.The results of experiment had indicated that the wettability of the solder was reduced when the content of Ag was decreased and improved when the amount of Bi was increased.Sn-0.5Ag-0.7Cu-3Bi showed good wettability (equivalent to SAC305),and was a kind of leadfree solder with good soldering process performance.

关 键 词： 无铅钎料 润湿性 助焊剂

领　　域： [金属学及工艺]