作　　者： ; ; ; ;

机构地区： 华南理工大学轻工与食品学院制浆造纸工程国家重点实验室

出　　处： 《中国胶粘剂》 2009年第10期4-7,共4页

摘　　要： 以双酚、甲醛和二胺为主要原料,以甲苯为溶剂,合成了苯并嗪(BOZ)中间体。采用红外光谱(FT-IR)技术对其结构进行了表征,同时采用差示扫描量热(DSC)法和热重分析(TGA)法对其固化过程及热稳定性能进行了研究。结果表明:双酚二胺类BOZ体系具有较宽的固化峰,其在200℃左右开始开环固化,具有良好的加工性能;700℃时的残炭率均超过40%(其中AFMDA体系为65%),耐温指数为185℃,说明该双酚二胺类BOZ体系是一种良好的耐高温材料,可以用于耐高温胶粘剂的制备。 With bisphenol, formaldehyde and diamine azine（BOZ） intermediate was synthesized. Its structure was as main raw materials, toluene as solvent, so a benzoxcharacterized by FT-IR, its curing process and thermal stability were investigated by DSC and TGA. The results showed that the BOZ system based on bisphenol-diamine had more wider curing peaks and well processability when its ring was opened and cured about 200 ℃. The BOZ system based on bisphenol-diamine was a well high temperature resistance material, could be used for preparing high temperature resistance adhesive because the rate of residual carbon exceeded 40% （65% in AFMDA system） at 700 ℃, and the temperature resistance index was 185 ℃.

关 键 词： 双酚 二胺 苯并 嗪 耐热性 固化

领　　域： [化学工程]