作　　者： ; ;

机构地区： 桂林电子工业学院机电工程学院机械电子工程系

出　　处： 《电子工艺技术》 1998年第5期170-174,共5页

摘　　要： 本文应用最小能量原理和有限元方法，建立塑料球栅阵列（ＰＢＧＡ）器件焊点三维形态预测模型，对ＰＢＡＧ焊点三维形态进行预测和分析。并将预测结果与试验结果以及国外学者用数学分析模型所得的预测结果进行了对比验证。 In this paper,minimal energy principle and finite element method were employed to developed solder joint shapes evolving model of plastic ball grid array(PBAG).And three-dimensional solder joint shapes of PBGA was predicted and analyzed.Comparisons were made between results predicted by the current model here and experimental measurments and those generated by mathematical analysis model at abroad.

关 键 词： 球栅阵列 焊点形态 最小能量原理

领　　域： [电子电信]