机构地区: 中南工业大学材料科学与工程系
出 处: 《中国有色金属学报》 1998年第3期427-430,共4页
摘 要: 采用硬度、金相和透射电镜等分析测试手段研究了一种AlMgSc合金的再结晶温度和再结晶形核机制。结果表明:合金的再结晶起始温度为375℃,终了温度为520℃;合金再结晶温度高的原因是细小弥散的Al3Sc质点对位错和亚晶界的钉扎作用;合金的再结晶形核机制为亚晶合并和亚晶长大的双重作用。 The recrystallizing temperature and nucleation mechanism of an Al Mg Sc alloy have been studied by hardness measurement, optical microscope and transmission electron microscope. The results show that the starting temperature point is 375 ℃ while the ending temperature point is 520 ℃ in the recrystallization of the alloy. The increase in recrystallizing temperature is caused by the pinning effect of highly dispersed Al 3Sc precipitates on dislocation and subgrain boundary. The recrystallizing process presents itself the nucleation mechanism of the alloy involving not only the subgrain coalescence but also the subgrain growth.