机构地区: 广东工业大学机电工程学院
出 处: 《信息化纵横》 2009年第14期67-69,73,共4页
摘 要: 以STC12C2052AD单片机芯片为控制核心,采用PID控制技术,设计了一套针对半导体封装设备超声波金丝球焊线机的焊接压力控制系统。使其具备了高精度、多参数设置、高灵敏度、用户界面友好以及系统成本低等特点。 This paper studys the semiconductor packaging equipment, designs a welding pressure process control system in ultrasonic gold wire bonding machine. The CPU used in this system is STC 12C2052AD chip. The PID technology was used to design a smart wire-bonding process control system.This system has advantages such as high precision, multi-parameter setting, high sensitionvity, friendly interface, low-cost system and so on.
关 键 词: 超声波焊接
领 域: [自动化与计算机技术] [自动化与计算机技术]