作　　者： ;

机构地区： 深圳职业技术学院

出　　处： 《微计算机信息》 2009年第19期271-273,共3页

摘　　要： 微电子组装过程中,焊点形态直接影响焊点的质量和可靠性。对焊点形态的预测是焊点质量控制和可靠性分析的基础。本文采用有限元方法,并结合能量最小原理实现了焊点三维形态的预测。通过建立有限元模型,进行边界和体积约束,重力势能和表面势能约束,完成了表贴电阻的焊点三维形态预测,并对形态预测中的网格畸变进行了修正。经试验验证焊点形态预测准确,为焊点的质量和可靠性分析打下了基础。 In the field of microelectronics assembly, solder joint shape make a direct impact on its quality and reliability. Solder joint quality control and reliability analysis is based on the prediction of solder joint shape. In this paper, finite element method, combined with energy minimization principle achieves a three-dimensional solder joint shape prediction. Through the creation of finite element model for the boundary and size constraints, gravitational potential energy and potential energy surface bound, thus completing the form of surface mount resistor three-dimensional shape prediction, and prediction of shape distortion grid amended. Tested to verify accuracy of solder joint shape prediction for solder joint quality and reliability of analysis laid the foundation.

关 键 词： 有限元 焊点形态 三维 形态预测

领　　域： [电子电信]