作　　者： ; ; ; ;

机构地区： 中南大学材料科学与工程学院粉末冶金国家重点实验室

出　　处： 《材料保护》 2009年第5期32-35,共4页

摘　　要： 目前,铜基或铁基上化学镀锡存在连续性差、沉积速率慢等问题,为实现连续化学镀锡,提高沉积速率,设计了一种新的化学镀锡工艺,考察了化学镀锡主要工艺参数(镀液主成分、pH值、温度、施镀时间)对镀层表面形貌及厚度的影响。结果表明,最佳工艺参数为:20.0～25.0 g/L氯化亚锡,70.0～75.0 g/L次亚磷酸钠,70.0～75.0 g/L硫脲,75.0～80.0 g/L硫酸,5.0～8.0 g/L甲基磺酸,5.0～8.0 g/LEDTA,2.0～4.0 g/L对苯二酚,10.0～15.0 g/L乙二醇,0.5～1.0 g/L磷酸,0.5～1.0 g/L甲醛,0.5～1.0 g/L OP-10,温度80～85℃,pH值0.6～0.8。该工艺可实现连续化学镀锡,施镀3 h厚度可达32.72μm。 In order to realize continuous tin electroless plating and increase the deposition rate, a new method was established. The effects of plating parameters (such as bath composition, pH val-ue, temperature, plating time, and stirring rate) on the surface morphology and thickness of the coating were investigated by means of scanning electron microscopy (SEM) , X-ray diffraction (XRD) , energy dispersive spectrometry (EDX) , and chemical analysis. Results show that the optimal temperature and pH value for tin electroless plating were determined to be 80～ 85 ℃ and 0.6 ～0.8, and the optimized bath was composed of 20.0～25.0 g/L SnCl2, 70. 0 ～ 75. 0 g/L ( NH2 )2 CS, 70.0 ～ 75. 0 g/L NaH2P02 ? 2H2 0, 75. 0 ～ 80. 0 g/L H2SO4, 5. 0～ 8. 0 g/L CH4O3S,5.0～8.0g/L EDTA, 2.0～4.0g/L C6H6O2, 10.0～15.0 g/L C2H6O2, 0.5 ～1.0 g/L H3P04, 0.5 -1.0 mL/L HCHO, and 1.0 g/L OP-10. Using the established tech-nology, it was feasible to conduct continuous tin electroless plat-ing, and the thickness of the coating after 3 hour of continuous plating was as much as 32.72 μm.

关 键 词： 化学镀锡 工艺参数 连续化学镀 厚度 表面形貌

领　　域： [化学工程]