作　　者： ; ; ;

机构地区： 茂名学院

出　　处： 《河北化工》 2008年第8期27-30,共4页

摘　　要： 针对裸露的电子元件及其连接组合,研究以乙烯基硅油和氢基硅油为主要组分的有机硅橡胶作为灌封材料。比较了不同含量的H基硅油作为交联剂对凝胶时间的影响;探讨了催化剂有机铂络合物中毒的原因,对着色剂进行了元素分析,相应提出了抗中毒措施,并得出了有效的抗毒剂;并针对电子元件及其连接组合在使用过程中会产生热量的问题,研制出了导热型电子模块灌封材料;同时,比较了不同抑制剂的抑制效果。 Vinyl silicone oil and hydrogen silicone oil as the main pound of the pouring silicone rubber system were obtained for one kind of pouring silicone rubber dielectric used in electronic mould. Difference hydrogen silicone oil as crosslinking agent will effect the time of gelation. Colorant element can makethe pouring silicone rubber system with difference colour ,but it can poison the catalyst . The cause of catalyst poisoning and poisoning inhabitation method were obtained experimentally which can be used in actual application for the pouring silicone rubber system and get the number of catalyst .Comparing with the effect of difference counterpoison and get the support of technical in controlling the time of vulcanization .

关 键 词： 有机硅 灌封材料 乙烯基硅油 氢基硅油

领　　域： [化学工程]