作　　者： ; ; ; ;

机构地区： 中国科学院

出　　处： 《燃料化学学报》 2008年第3期371-375,共5页

摘　　要： The thermal decomposition of a kind of brominted epoxy resin(BER) printed circuit boards was investigated by using TG-FTIR and Py-GC/MS.The mechanism of the thermal decomposition of the resin was discussed.The experimental results show that during the thermal decomposition of BER,the brominated parts are firstly decomposed with the splitting of OH—C,O—CH2,C—C(Benzene) bonds,and the pyrolysis products such as CO,acetone,bromomethane,bromophenol and 2,6-dibromophenol are produced.The decomposition of unbrominated parts is conducted at higher temperature with the splitting of OH—C,CH2—O—benzene,C—C(Benzene) bonds,and the pyrolysis products containing phenol,p-isopropylphenol,p-isopropenylacetylphenol,o-methylphenol and p-methylphenol are made. The thermal decomposition of a kind of brominted epoxy resin （BER） printed circuit boards was investigated by using TG-FTIR and Py-GC/MS. The mechanism of the thermal decomposition of the resin was discussed. The experimental results show that during the thermal decomposition of BER, the brominated parts are firstly decomposed with the splitting of OH-C, O-CH2, C-C （Benzene） bonds, and the pyrolysis products such as CO, acetone, bromomethane, bromophenol and 2,6-dibromophenol are produced. The decomposition of unbrominated parts is conducted at higher temperature with the splitting of OH-C, CH2-O-benzene, C-C （Benzene） bonds, and the pyrolysis products containing phenol, p-isopropylphenol, p-isopropenylacetylphenol, o-methylphenol and p-methylphenol are made.

关 键 词： 溴化环氧树脂 印刷线路板 热解 热重 红外联用分析 热解 气相色谱 质谱联用分析

领　　域： [环境科学与工程]