机构地区: 天津工业大学机械工程学院
出 处: 《Journal of Semiconductors》 2008年第6期1111-1116,共6页
摘 要: This paper introduces a new technology to fabricate a micro electromagnetic actuator with high energy density without an enclosed magnetic circuit. This technology includes fabricating multi-turns planar micro coils and fabricating the thick magnetic (NiFe) core on the silicon wafer. The multi-turns planar micro coils are fabricated by the electroplating method from the surface along the line and by dynamically controlling the current density of the copper electrolytes. In order to fabricate thick NiFe plating,the adhesion properties between the NiFe plating and the silicon substrates are improved by changing the surface roughness of the silicon substrates and increasing the thickness of the seed layer. Furthermore,the micro electromagnetic actuator is tested and the energy density of the actuator is evaluated by force testing. The experiments show that the microactuator is efficient in producing high magnetic energy density and high magnetic force. 提出了一种非闭合磁路型高能量密度微电磁驱动器的制作方法,即利用MEMS工艺在单位面积硅基体上制作多匝、高深宽比的平面线圈和高厚度的磁芯.通过先面电铸再线电铸的方式,以及动态控制电铸电流密度的方法进行平面线圈的制作;通过改变衬底表面粗糙度和种子层厚度的方法,改善合金镀层与衬底的粘附性能,可以在单位面积的硅片上,制作出厚度更大的磁性合金镀层.初步实验结果表明:该微型电磁驱动器在相同的输入功率下,比同类其他微电磁驱动器,能产生更大的电磁驱动力,具有更高的能量密度.
领 域: [自动化与计算机技术] [自动化与计算机技术]