作　　者： ; ; ; ;

机构地区： 西安电子科技大学通信工程学院

出　　处： 《中国集成电路》 2007年第12期22-27,共6页

摘　　要： 随着半导体技术进入超深亚微米时代,人们已经可以将越来越多的器件集成到单一芯片上来。运用传统的片上总线结构进行通信将面临诸多问题,如可扩展性差、定时困难和无法提供并行通信能力等,所以要运用片上网络来满足片上通信的带宽和能耗要求。本文研究了片上网络中的一项关键技术——交换机制。交换机制定义了消息在网络中交换的方式,并规定了沿输出端口将消息转发出去的时机。文章对片上网络中常用的电路交换、分组交换、虫孔交换和虚切通交换等进行了分析,并从能耗、面积、时延以及吞吐等性能方面进行了对比,给出了有益于片上网络沿用的结论。 The technology of deep submicron enables a large amount of components being integrated onto a single chip. Lack of scalability, synchronization difficulties, and lack of parallel communication are all examples of problems encountered when adopting the traditional on-chip architecture of buses. At this very moment, the concept of on-chip network is needed to fulfill the bandwidth and power consumption requirements in on-chip communication. This paper considers one of the most important technologies in the context of on-chip network, the switching mechanism. It is in charge of defining the way to switch messages, as well as the time to forward them along a certain output port. Several Network-on-Chip mechanisms commonly used, circuit switching, packet switching, wormhole and virtual cut-through switching, are analyzed and compared from power consumption, area cost, delay and throughput aspects in this paper. And finally, we obtain a proper conclusion for Network-on-Chip switching mechanism.

关 键 词： 片上网络 电路交换 分组交换 虫孔交换 虚切通交换

领　　域： [自动化与计算机技术] [自动化与计算机技术]