作　　者： ; ; ; ; ; ;

机构地区： 信息产业部电子第五研究所

出　　处： 《失效分析与预防》 2007年第4期55-58,共4页

摘　　要： FCBGA(Flip-chip ball grid array)封装形式器件是近年来集成电路封装的最佳选择,其可靠性日益引起重视。本文简要介绍了FCBGA封装形式器件的结构特点以及相关的可靠性问题,通过两个FCBGA封装器件失效的案例,分析了两只FCBGA器件失效的原因,一个是由于芯片上的焊球间存在铅锡焊料而导致焊球短路,另一个则是因封装内填料膨胀分层而导致的焊球开路。本文提出了针对这种形式封装的器件在使用过程中的注意事项及预防措施,以减少该类失效情况的发生。 Nowadays, FCBGA （Flip -chip ball grid array ）is the optimal choice for IC＇s package. Focus should be put on its reliability. The structure characteristic of FCBGA packaged devices and some correlative reliability problems of them were introduced in this paper. By two failure analysis cases of FCBGA devices, the author found the failure mechanisms of the two failed devices. They are short of the solder balls and open of the solder bumps on the FC die, respectively. The cause for short is the solder melted and made the nearby solder balls linked. The cause for open is the epoxy underfill between the solder bumps expanded and made the solder bumps ruptured. In the end, some precautions for reducing such failures are presented.

关 键 词： 失效机理 失效分析

领　　域： [机械工程] [交通运输工程] [交通运输工程]