机构地区: 深圳信息职业技术学院
出 处: 《电子工艺技术》 2007年第3期157-159,162,共4页
摘 要: BGA空洞是BGA组装过程常见的工艺缺陷,系统介绍了BGA空洞形成的机理与主要影响因素,讨论了BGA空洞的接受标准及其对焊点可靠性的影响,提出了消除及减少空洞缺陷的主要措施。 BGA Void is a kind of popular process defects in SMT assembly. Formation mechanism and root causes of BGA voids are introduced. Pass standards of BGA void and BGA void affects on solder joint reliability are discussed. Then troubleshooting solutions for BGA void defect are presented.
领 域: [电子电信]